Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy. Heat spreading packaging solutions for hybrid bonded 3D-ICs. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-6, IEEE, 2016. [doi]
@inproceedings{PrietoCCHCRDRFB16,
title = {Heat spreading packaging solutions for hybrid bonded 3D-ICs},
author = {Rafael Prieto and Perceval Coudrain and Jean-Philippe Colonna and Y. Hallez and Christian Chancel and V. Rat and Sylvain Dumas and G. Romano and R. Franiatte and C. Brunet-Manquiat and Séverine Cheramy and Alexis Farcy},
year = {2016},
doi = {10.1109/3DIC.2016.7970038},
url = {https://doi.org/10.1109/3DIC.2016.7970038},
researchr = {https://researchr.org/publication/PrietoCCHCRDRFB16},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1399-9},
}