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Heat spreading packaging solutions for hybrid bonded 3D-ICs

Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy. Heat spreading packaging solutions for hybrid bonded 3D-ICs. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-6, IEEE, 2016. [doi]

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Rafael Prieto

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Perceval Coudrain

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Jean-Philippe Colonna

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Y. Hallez

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Christian Chancel

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V. Rat

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Sylvain Dumas

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G. Romano

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R. Franiatte

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C. Brunet-Manquiat

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Séverine Cheramy

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Alexis Farcy

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