Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy. Using TSVs for thermal mitigation in 3D circuits: Wish and truth. In 2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale, Ireland, December 1-3, 2014. pages 1-8, IEEE, 2014. [doi]
Abstract is missing.