Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Francis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey. Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-6, IEEE, 2009. [doi]
Abstract is missing.