Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design

Kanchan Manna, Shivam Swami, Santanu Chattopadhyay, Indranil Sengupta 0001. Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC Design. ACM Trans. Embedded Comput. Syst., 16(1):24, 2016. [doi]

Abstract

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