Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, K. J. Rebibis, W. Zhang, Eric Beyne. 3D stacking using ultra thin dies. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
@inproceedings{MannaVBDRZB11,
title = {3D stacking using ultra thin dies},
author = {Antonio La Manna and Dimitrios Velenis and Thibault Buisson and Mikael Detalle and K. J. Rebibis and W. Zhang and Eric Beyne},
year = {2011},
doi = {10.1109/3DIC.2012.6262951},
url = {http://dx.doi.org/10.1109/3DIC.2012.6262951},
researchr = {https://researchr.org/publication/MannaVBDRZB11},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}