Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs

Erik Jan Marinissen. Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs. In Wolfgang Rosenstiel, Lothar Thiele, editors, 2012 Design, Automation & Test in Europe Conference & Exhibition, DATE 2012, Dresden, Germany, March 12-16, 2012. pages 1277-1282, IEEE, 2012. [doi]

Abstract

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