Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests

Alessandro Marras, M. Impronta, Ilaria De Munari, M. G. Valentini, A. Scorzoni. Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests. Microelectronics Reliability, 47(9-11):1492-1496, 2007. [doi]

Abstract

Abstract is missing.