Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting

S. Martens, B. Krueger, W. Mack, F. Voelklein, J. Wilde. Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting. Microelectronics Reliability, 48(8-9):1513-1516, 2008. [doi]

Abstract

Abstract is missing.