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Packaging and integration technologies for future high-frequency power supplies

Seán Cian Ó Mathúna, Patrick Byrne, Gerald Duffy, Weimin Chen, Matthias Ludwig, Terence O'Donnell, Paul McCloskey, Maeve Duffy. Packaging and integration technologies for future high-frequency power supplies. IEEE Transactions on Industrial Electronics, 51(6):1305-1312, 2004. [doi]

Authors

Seán Cian Ó Mathúna

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Patrick Byrne

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Gerald Duffy

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Weimin Chen

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Matthias Ludwig

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Terence O'Donnell

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Paul McCloskey

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Maeve Duffy

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