Seán Cian Ó Mathúna, Patrick Byrne, Gerald Duffy, Weimin Chen, Matthias Ludwig, Terence O'Donnell, Paul McCloskey, Maeve Duffy. Packaging and integration technologies for future high-frequency power supplies. IEEE Transactions on Industrial Electronics, 51(6):1305-1312, 2004. [doi]
@article{MathunaBDCLOMD04,
title = {Packaging and integration technologies for future high-frequency power supplies},
author = {Seán Cian Ó Mathúna and Patrick Byrne and Gerald Duffy and Weimin Chen and Matthias Ludwig and Terence O'Donnell and Paul McCloskey and Maeve Duffy},
year = {2004},
doi = {10.1109/TIE.2004.837904},
url = {http://dx.doi.org/10.1109/TIE.2004.837904},
researchr = {https://researchr.org/publication/MathunaBDCLOMD04},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Industrial Electronics},
volume = {51},
number = {6},
pages = {1305-1312},
}