T. Matsudaira, S. Shindo, T. Shimizu, T. Ito, S. Shinguhara, S. Shimizu. Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{MatsudairaSSISS19,
title = {Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application},
author = {T. Matsudaira and S. Shindo and T. Shimizu and T. Ito and S. Shinguhara and S. Shimizu},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058791},
url = {https://doi.org/10.1109/3DIC48104.2019.9058791},
researchr = {https://researchr.org/publication/MatsudairaSSISS19},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}