Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo. Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-8, IEEE, 2013. [doi]
@inproceedings{MatsumotoISSKMOYFTK13,
title = {Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack},
author = {Keiji Matsumoto and Soichiro Ibaraki and Kuniaki Sueoka and Katsuyuki Sakuma and Hidekazu Kikuchi and Hiroyuki Mori and Yasumitsu Orii and Fumiaki Yamada and Kohei Fujihara and Junichi Takamatsu and Koji Kondo},
year = {2013},
doi = {10.1109/3DIC.2013.6702329},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702329},
researchr = {https://researchr.org/publication/MatsumotoISSKMOYFTK13},
cites = {0},
citedby = {0},
pages = {1-8},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}