Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

Marco Matteucci, Arto Heiskanen, Kinga Zór, Jenny Emnéus, Rafael J. Taboryski. Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry. Sensors, 16(11):1795, 2016. [doi]

Abstract

Abstract is missing.