Federico Mazza, Yan Liu 0016, Nick Donaldson, Timothy G. Constandinou. Integrated Devices for Micro-Package Integrity Monitoring in mm-Scale Neural Implants. In 2018 IEEE Biomedical Circuits and Systems Conference, BioCAS 2018, Cleveland, OH, USA, October 17-19, 2018. pages 1-4, IEEE, 2018. [doi]
Abstract is missing.