Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture

Jack F. McDonald, Hans J. Greub, Randy H. Steinvorth, Brian J. Donlan, Albert S. Bergendahl. Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. IEEE Computer, 20(4):21-35, 1987.

Abstract

Abstract is missing.