Bryan L. McLaughlin, Brian Smith, John Lachapelle, Dan Traviglia, Tirunelveli S. Sriram, David O'Dowd. Ultra-high density packaging technology for injectable medical devices. In 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2011, Boston, MA, USA, August 30 - Sept. 3, 2011. pages 2897-2900, IEEE, 2011. [doi]
Abstract is missing.