R. Ch. Meier, V. Badilita, U. Wallrabe, J. G. Korvink. Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination. In 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012. pages 308-311, IEEE, 2012. [doi]
@inproceedings{MeierBWK12,
title = {Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination},
author = {R. Ch. Meier and V. Badilita and U. Wallrabe and J. G. Korvink},
year = {2012},
doi = {10.1109/NEMS.2012.6196781},
url = {http://dx.doi.org/10.1109/NEMS.2012.6196781},
researchr = {https://researchr.org/publication/MeierBWK12},
cites = {0},
citedby = {0},
pages = {308-311},
booktitle = {7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012, Kyoto, Japan, March 5-8, 2012},
publisher = {IEEE},
isbn = {978-1-4673-1122-9},
}