Ying Meng, Runhua Gao, Xinhua Wang, Xiaojuan Chen, Sen Huang, Ke Wei, Dahai Wang, Fengwen Mu, Xinyu Liu. Direct Cu-polyimide Bonding Achieved by Surface Activation and Pt-catalyzed Formic Acid Atmosphere. In 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021, Zhuhai, China, November 24-26, 2021. pages 201-203, IEEE, 2021. [doi]
Abstract is missing.