Wei Meng, Qinghua Zeng, Yong Guan, Jing Chen, Yufeng Jin. Thermal-mechanical reliability analysis of connection structure between redistribution layer and TSV for MEMS packaging. In 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, April 17-20, 2016. pages 384-387, IEEE, 2016. [doi]
Abstract is missing.