Florian Merget, M. Ackermann, B. Shen, G. D. Saunders, S. Haag, M. Wolz, Jeremy Witzens. Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging. In European Conference on Optical Communication, ECOC 2021, Bordeaux, France, September 13-16, 2021. pages 1-4, IEEE, 2021. [doi]
@inproceedings{MergetASSHWW21,
title = {Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging},
author = {Florian Merget and M. Ackermann and B. Shen and G. D. Saunders and S. Haag and M. Wolz and Jeremy Witzens},
year = {2021},
doi = {10.1109/ECOC52684.2021.9605906},
url = {https://doi.org/10.1109/ECOC52684.2021.9605906},
researchr = {https://researchr.org/publication/MergetASSHWW21},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {European Conference on Optical Communication, ECOC 2021, Bordeaux, France, September 13-16, 2021},
publisher = {IEEE},
isbn = {978-1-6654-3868-1},
}