Florian Merget, M. Ackermann, B. Shen, G. D. Saunders, S. Haag, M. Wolz, Jeremy Witzens. Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging. In European Conference on Optical Communication, ECOC 2021, Bordeaux, France, September 13-16, 2021. pages 1-4, IEEE, 2021. [doi]
Abstract is missing.