S. Mermoz, L. Sanchez, Léa Di Cioccio, J. Berthier, E. Deloffre, C. Fretigny. Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
Abstract is missing.