In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens

James C. E. Mertens, Antony Kirubanandham, Nikhilesh Chawla. In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens. Microelectronics Reliability, 55(11):2345-2353, 2015. [doi]

Abstract

Abstract is missing.