Xiaoyu Mi, Osamu Toyoda, Satoshi Ueda, Fumihiko Nakazawa. A 3D heterogeneous integration method using LTCC wafer for RF applications. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
@inproceedings{MiTUN11, title = {A 3D heterogeneous integration method using LTCC wafer for RF applications}, author = {Xiaoyu Mi and Osamu Toyoda and Satoshi Ueda and Fumihiko Nakazawa}, year = {2011}, doi = {10.1109/3DIC.2012.6262955}, url = {http://dx.doi.org/10.1109/3DIC.2012.6262955}, researchr = {https://researchr.org/publication/MiTUN11}, cites = {0}, citedby = {0}, pages = {1-5}, booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, publisher = {IEEE}, isbn = {978-1-4673-2189-1}, }