A 3D heterogeneous integration method using LTCC wafer for RF applications

Xiaoyu Mi, Osamu Toyoda, Satoshi Ueda, Fumihiko Nakazawa. A 3D heterogeneous integration method using LTCC wafer for RF applications. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]

Abstract

Abstract is missing.