A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge

Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan. A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. In 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, Xiamen, China, January 20-23, 2010. pages 399-403, IEEE, 2010. [doi]

Abstract

Abstract is missing.