Xue Ming, Koelz Johann, Lee Chow York, Lee Kwan Wee, Shi Zhi Min. Electrical package defect testing for volume production. In 2015 IEEE International Test Conference, ITC 2015, Anaheim, CA, USA, October 6-8, 2015. pages 1-9, IEEE, 2015. [doi]
@inproceedings{MingJYWM15,
title = {Electrical package defect testing for volume production},
author = {Xue Ming and Koelz Johann and Lee Chow York and Lee Kwan Wee and Shi Zhi Min},
year = {2015},
doi = {10.1109/TEST.2015.7342400},
url = {http://dx.doi.org/10.1109/TEST.2015.7342400},
researchr = {https://researchr.org/publication/MingJYWM15},
cites = {0},
citedby = {0},
pages = {1-9},
booktitle = {2015 IEEE International Test Conference, ITC 2015, Anaheim, CA, USA, October 6-8, 2015},
publisher = {IEEE},
isbn = {978-1-4673-6578-9},
}