Nahid Mirzaie, Ron Rohrer. 3D IC Packaging Utilizing a Metal Structure for Heat Reduction, Noise Shielding, and High Interconnect Density. In 22nd International Symposium on Quality Electronic Design, ISQED 2021, Santa Clara, CA, USA, April 7-9, 2021. pages 269-274, IEEE, 2021. [doi]
Abstract is missing.