Effect of the drop impact on BGA/CSP package reliability

Kinuko Mishiro, Shigeo Ishikawa, Mitsunori Abe, Toshio Kumai, Yutaka Higashiguchi, Ken-ichiro Tsubone. Effect of the drop impact on BGA/CSP package reliability. Microelectronics Reliability, 42(1):77-82, 2002. [doi]

Abstract

Abstract is missing.