A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link - researchr publication authors

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Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue, Kiichi Niitsu, Yoshihiro Nakagawa, Masamoto Tago, Muneo Fukaishi, Takayasu Sakurai, Tadahiro Kuroda. A 1 Tb/s 3 W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link. J. Solid-State Circuits, 42(1):111-122, 2007. [doi]

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