Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe, Kosuke Kitaichi, Tadahiro Morifuji, Shoji Yasunaga. Development of high accuracy wafer thinning and pickup technology for thin wafer. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-4, IEEE, 2010. [doi]
@inproceedings{MiyazakiSUAKMY10,
title = {Development of high accuracy wafer thinning and pickup technology for thin wafer},
author = {Chuichi Miyazaki and Haruo Shimamoto and Toshihide Uematsu and Yoshiyuki Abe and Kosuke Kitaichi and Tadahiro Morifuji and Shoji Yasunaga},
year = {2010},
doi = {10.1109/3DIC.2010.5751470},
url = {http://dx.doi.org/10.1109/3DIC.2010.5751470},
researchr = {https://researchr.org/publication/MiyazakiSUAKMY10},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010},
publisher = {IEEE},
}