Fine-grain thermal profiling and sensor insertion for FPGAs

Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci Memik. Fine-grain thermal profiling and sensor insertion for FPGAs. In International Symposium on Circuits and Systems (ISCAS 2006), 21-24 May 2006, Island of Kos, Greece. IEEE, 2006. [doi]

Abstract

Abstract is missing.