L. Dantas de Morais, F. Allanic, F. Roqueta, J. P. Rebrasse. Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections. Microelectronics Reliability, 47(9-11):1614-1618, 2007. [doi]
@article{MoraisARR07,
title = {Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections},
author = {L. Dantas de Morais and F. Allanic and F. Roqueta and J. P. Rebrasse},
year = {2007},
doi = {10.1016/j.microrel.2007.07.056},
url = {http://dx.doi.org/10.1016/j.microrel.2007.07.056},
tags = {systematic-approach},
researchr = {https://researchr.org/publication/MoraisARR07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {9-11},
pages = {1614-1618},
}