Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections

L. Dantas de Morais, F. Allanic, F. Roqueta, J. P. Rebrasse. Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections. Microelectronics Reliability, 47(9-11):1614-1618, 2007. [doi]

Abstract

Abstract is missing.