Haruki Mori, Wei-Chang Zhao, Cheng-En Lee, Chia-Fu Lee, Yu-Hao Hsu, Chao-Kai Chuang, Takeshi Hashizume, Hao-Chun Tung, Yao-Yi Liu, Shin-Rung Wu, Kerem Akarvardar, Tan-Li Chou, Hidehiro Fujiwara, Yih Wang, Yu-Der Chih, Yen-Huei Chen, Hung-Jen Liao, Tsung-Yung Jonathan Chang. A 4nm 6163-TOPS/W/b $\mathbf{4790-TOPS/mm^{2}/b}$ SRAM Based Digital-Computing-in-Memory Macro Supporting Bit-Width Flexibility and Simultaneous MAC and Weight Update. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 132-133, IEEE, 2023. [doi]
@inproceedings{MoriZLLHCHTLWACFWCCLC23,
title = {A 4nm 6163-TOPS/W/b $\mathbf{4790-TOPS/mm^{2}/b}$ SRAM Based Digital-Computing-in-Memory Macro Supporting Bit-Width Flexibility and Simultaneous MAC and Weight Update},
author = {Haruki Mori and Wei-Chang Zhao and Cheng-En Lee and Chia-Fu Lee and Yu-Hao Hsu and Chao-Kai Chuang and Takeshi Hashizume and Hao-Chun Tung and Yao-Yi Liu and Shin-Rung Wu and Kerem Akarvardar and Tan-Li Chou and Hidehiro Fujiwara and Yih Wang and Yu-Der Chih and Yen-Huei Chen and Hung-Jen Liao and Tsung-Yung Jonathan Chang},
year = {2023},
doi = {10.1109/ISSCC42615.2023.10067555},
url = {https://doi.org/10.1109/ISSCC42615.2023.10067555},
researchr = {https://researchr.org/publication/MoriZLLHCHTLWACFWCCLC23},
cites = {0},
citedby = {0},
pages = {132-133},
booktitle = {IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023},
publisher = {IEEE},
isbn = {978-1-6654-9016-0},
}