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Low temperature direct bonding: An attractive technique for heterostructures build-up

H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, L. Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet. Low temperature direct bonding: An attractive technique for heterostructures build-up. Microelectronics Reliability, 52(2):331-341, 2012. [doi]

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H. Moriceau

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F. Rieutord

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F. Fournel

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Léa Di Cioccio

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C. Moulet

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L. Libralesso

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Pierric Gueguen

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Rachid Taibi

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C. Deguet

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