Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto. Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device. Microelectronics Reliability, 46(5-6):923-929, 2006. [doi]

Bibliographies