Eric R. Motto, John F. Donlon, Ming Shang, Kazuhiro Kuriaki, Toru Iwagami, Hisashi Kawafuji, Toshiya Nakano. Large Package Transfer Molded DIP-IPM. In Industry Applications Society Annual Meeting, IAS 2008, Edmonton, Alberta, Canada, 5-9 Octobert, 2008. pages 1-5, IEEE, 2008. [doi]
Abstract is missing.