Xin Mu, Frank Weiss, Hongyao Chua, Robert Lawrowski, Jared C. Mikkelsen, John N. Straguzzi, Hannes Wahn, Joyce K. S. Poon, Guo-Qiang Lo, Mariel Jama, Wesley D. Sacher. Flip-Chip Bonded 450-nm InGaN Laser Diodes in a Foundry Fabricated Visible-Light Silicon Photonics Platform. In Optical Fiber Communications Conference and Exhibition, OFC 2025, San Francisco, CA, USA, March 30 - April 3, 2025. pages 1-3, IEEE, 2025. [doi]
@inproceedings{MuWCLMSWPLJS25,
title = {Flip-Chip Bonded 450-nm InGaN Laser Diodes in a Foundry Fabricated Visible-Light Silicon Photonics Platform},
author = {Xin Mu and Frank Weiss and Hongyao Chua and Robert Lawrowski and Jared C. Mikkelsen and John N. Straguzzi and Hannes Wahn and Joyce K. S. Poon and Guo-Qiang Lo and Mariel Jama and Wesley D. Sacher},
year = {2025},
url = {https://ieeexplore.ieee.org/document/11046357},
researchr = {https://researchr.org/publication/MuWCLMSWPLJS25},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {Optical Fiber Communications Conference and Exhibition, OFC 2025, San Francisco, CA, USA, March 30 - April 3, 2025},
publisher = {IEEE},
isbn = {978-1-55752-737-0},
}