Seshagopalan Thorapalli Muralidharan, Georgios Andrikopoulos, Lei Feng 0002. A Survey on the Current Trends and Applications of Design Optimization for Compliant and Soft Robotics. In IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2023, Seattle, WA, USA, June 28-30, 2023. pages 47-53, IEEE, 2023. [doi]
@inproceedings{MuralidharanAF23,
title = {A Survey on the Current Trends and Applications of Design Optimization for Compliant and Soft Robotics},
author = {Seshagopalan Thorapalli Muralidharan and Georgios Andrikopoulos and Lei Feng 0002},
year = {2023},
doi = {10.1109/AIM46323.2023.10196108},
url = {https://doi.org/10.1109/AIM46323.2023.10196108},
researchr = {https://researchr.org/publication/MuralidharanAF23},
cites = {0},
citedby = {0},
pages = {47-53},
booktitle = {IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2023, Seattle, WA, USA, June 28-30, 2023},
publisher = {IEEE},
isbn = {978-1-6654-7633-1},
}