Yoshio Muraoka, Kenichi Seki, Hidekazu Nishimura. Thermal Management of Software Changes in Product Lifecycle of Consumer Electronics. In Shuichi Fukuda, Alain Bernard, Balan Gurumoorthy, Abdelaziz Bouras, editors, Product Lifecycle Management for a Global Market - 11th IFIP WG 5.1 International Conference, PLM 2014, Yokohama, Japan, July 7-9, 2014, Revised Selected Papers. Volume 442 of IFIP Advances in Information and Communication Technology, pages 237-246, Springer, 2014. [doi]
Abstract is missing.