Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack - researchr publication authors

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Tomohide Murase, Hiroyuki Aikyou, Fumikazu Mizutani, Yu Shoji, Tomoya Higashihara, Mitsuru Ueda. Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]

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