SiLK:::TM::: etch optimization and electrical characterization for 0.13 mum interconnects

Ramana Murthy, Y.-W. Chen, A. Krishnamoorthy, X. T. Chen. SiLK:::TM::: etch optimization and electrical characterization for 0.13 mum interconnects. Microelectronics Reliability, 45(3-4):507-516, 2005. [doi]

Abstract

Abstract is missing.