Muhannad Mustafa, Jeffrey C. Suhling, Pradeep Lall. Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging. Microelectronics Reliability, 56:136-147, 2016. [doi]
@article{MustafaSL16,
title = {Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging},
author = {Muhannad Mustafa and Jeffrey C. Suhling and Pradeep Lall},
year = {2016},
doi = {10.1016/j.microrel.2015.10.021},
url = {http://dx.doi.org/10.1016/j.microrel.2015.10.021},
researchr = {https://researchr.org/publication/MustafaSL16},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {56},
pages = {136-147},
}