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Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging

Muhannad Mustafa, Jeffrey C. Suhling, Pradeep Lall. Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging. Microelectronics Reliability, 56:136-147, 2016. [doi]

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