Harini Muthukrishnan, Daniel Lustig, Oreste Villa, Thomas F. Wenisch, David W. Nellans. FinePack: Transparently Improving the Efficiency of Fine-Grained Transfers in Multi-GPU Systems. In IEEE International Symposium on High-Performance Computer Architecture, HPCA 2023, Montreal, QC, Canada, February 25 - March 1, 2023. pages 516-529, IEEE, 2023. [doi]
Abstract is missing.