Experimental study of bump void formation according to process conditions

Seong-Hun Na, Seung-Kyu Lim, Jin-Soo Kim, Hwa-Sun Park, Heung-Jae Oh, Jin-Won Choi, Su-Jeong Suh. Experimental study of bump void formation according to process conditions. Microelectronics Reliability, 53(4):638-644, 2013. [doi]

Abstract

Abstract is missing.