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Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs

Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic. Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. In IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023. pages 1-4, IEEE, 2023. [doi]

Authors

Mohamed Naeim

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Hanqi Yang

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Pinhong Chen

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Rong Bao

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Antoine Dekeyser

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Giuliano Sisto

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Moritz Brunion

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Rongmei Chen

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Geert Van der Plas

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Eric Beyne

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Dragomir Milojevic

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