Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba. Characterization of stress distribution in ultra-thinned DRAM wafer. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
@inproceedings{NakamuraMKSO15,
title = {Characterization of stress distribution in ultra-thinned DRAM wafer},
author = {Tomoji Nakamura and Yoriko Mizushima and Young-Suk Kim and Ryuichi Sugie and Takayuki Ohba},
year = {2015},
doi = {10.1109/3DIC.2015.7334558},
url = {http://dx.doi.org/10.1109/3DIC.2015.7334558},
researchr = {https://researchr.org/publication/NakamuraMKSO15},
cites = {0},
citedby = {0},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9385-0},
}